报告题目：Achieving Power Integrity through Systematic Design

报告人：J. L. Drewniak, Missouri S&T EMC Laboratory, Rolla, MO, USA

报告地点：行政楼108-111

报告时间：10月17日  下午2:00

Abstract：

Power integrity in high-speed digital designs is among the most significant design challenges for high data rate and high speed systems.  Best engineering practices for design of a power distribution network at the package and PCB level are well known.  In practice this comes down to minimizing inductance over the current-draw path at all frequencies.  However, there are many subtle design choices that can impact achieving a minimal power net voltage ripple.  In order to achieve a best design with or without constraints on some of these choices, a proven methodology for calculating the portions of inductance associated with particular geometry features is necessary, and a knowledge of inductance physics that can be exploited to minimize inductance using mutual inductance concepts to achieve reduction better than 1/N when simply adding another decoupling capacitor in parallel.

A methodology has been developed for PDN design and PI analysis that can readily identify a best design for the package and PCB given typical design constraints such as BGA pitch, package stackup, package with or without decoupling, PCB stackup, and signal routing egress and ingress, among others.  A methhod for ZPDN calculation and circuit extraction has been developed, that can be used to calculate the PDN impedance.  If the target impedance specification is not met, the developed methodology and tool set can be used to immediately identify if specifications can be met with design modifications within the constraints, and exactly how to do so without trial-and-error simulations with a modeling tool.

Biography：

James L. Drewniak received B.S., M.S., and Ph.D. degrees in electrical engineering from the University of Illinois at Urbana-Champaign.  He is with Electromagnetic Compatibility Laboratory in the Electrical Engineering Department at Missouri University of Science and Technology (formerly University of Missouri-Rolla).  His research and teaching interests include electromagnetic compatibility in high-speed digital and mixed-signal designs, signal and power integrity, electronic packaging, electromagnetic compatibility in power electronic based systems, electronics, and antenna design.

He is a leader of a university research laboratory that is internationally recognized for research in EMC and signal and power integrity, with approximately 60 people, including tenured faculty, research professors,  post-doctoral fellows, and over 35 graduate students.  The funding for the laboratory is a balance of US government sponsors as well as industry.  The laboratory includes a state-of-the-art laboratory facility.  A key funding component of the research is a US National Science Foundation Industry/University Research Center (I/UCRC) that is a consortium of approximately 20 companies.

He is a Fellow of the IEEE, and recipient of the IEEE EMC Society’s highest award for technical achievement the Richard R. Stoddart Award in 2013, a past Chair of the IEEE EMC Society technical committees TC-9 Computational EM, and TC-10 Signal Integrity, as well as a past Associate Editor of the IEEE Transactions on EMC.